DIP-Buchsen für QFN56(8×8)-0.5 Test- und Programmier-Sockel, 0.5mm Pitch, IC550-0564-010-G, Clamshell-Design, ideal für MLF56 und WLCSP56 Anwendungen

Supported Package: QFN56, MLF56, WLCSP56

Socket P/N: IC550-0564-010-G, QFN56(8×8)-0.5-SCL

Application IC: 0.5mm Pitch, IC body size: 8×8 mm

QFN IC MCU Burn-in Socket Programming Adapter

Structure Type: Clamshell Socket

Produktbeschreibungen

ALLSOCKET: Professional manufacturer in making all kinds of IC package(BGA QFN QFP,TSOP,SSOP) testing sockets and adapters, as well as customizing CPU GPU LPDDR DDR Tester socket.Any other questions regarding to products, please contact us[amanda(@)allsocket.com]. Technical support and datasheet are available.Material & Specifics: QFN MLF WLCSP MCU Package Structure: Clamshell/Open-top Version Socket Body: PEI Contacts: Beryllium Copper Alloy Contact Plating: Gold over nickel Operation Force: Max 2.0kg Contact Resistance: Max 50 mohm Insulation Resistance: 1,000 mohm min. at DC 500V Dielectric withstanding voltage For 1 Minute at AC 700V Current: Max 2A Operation Temperature: -40 ~ 150 Celsius degree Operation Life: 15,000 cycles(Mechanical) Use method: Assemble to be an adapter Assemble onto a test board Assemble and make a test jig Package contained: *1pcs, ALLSOCKET-QFN Socket